Thermal Interface Material (TIM) Market is anticipated to hit $2.1 billion by 2023 at a CAGR of 7.40%

Asia Pacific region holds the largest market share and growth in the Thermal Interface Materials Market, and is anticipated to reach $1.3 billion by 2023

HYDERABAD, TELANGANA, INDIA, June 19, 2018 /EINPresswire.com/ -- According to the new market research report by IndustryARC titled “Thermal Interface Materials Market: By Type (Greases & adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs, Phase Change Materials, and others); By Application (Industrial and Energy, Consumer Electronics, Medical Devices, Automotive and power electronics, Computers, Telecom, Aerospace and defense electronics and others Medical Devices, Others) & By Geography Forecast (2018-2023)”, the market is driven by the ongoing trend for product miniaturization, coupled with higher powered electronic devices.

APAC held the largest market share and growth rate in the Thermal Interface Materials Market

Asia Pacific region holds the largest market share and growth in the Thermal Interface Materials Market, and is anticipated to reach $1.3 billion by 2023 at a CAGR of 8%. The factor that led to this growth is the rapid industrialization and humongous amount of manufacturing in this region. The key applications in this region include Medical Devices, Telecommunications, and Computers among others.

Selected Value Chain Analysis done in the full report

Value chain analysis is a useful tool to analyze the activities that include design, production, marketing and distribution of a particular product. TIM’s market is complex, and a key part of the electronics industry. In addition, it’s a changing business and one that adds significantly more than electronics packages and components to the value chain. It is also a business, which is well positioned to add even greater value in the future. The major steps involved in contributing to the total value chain of TIM market are described below:
The Value chain of TIM analyzes the major steps involved in manufacturing raw materials, thermally conductive materials in this case, and then adding these materials to electronic devices in order to produce thermally conductive electronic devices. Increasing raw material prices have been a concern of the industry for the past few years. Therefore, several companies have had to emphasize on the supply chain issues concerning raw material prices and manage their formulation or performance criteria carefully.

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Excerpts on Market Growth Factors

Growing innovation in technology such as use of carbon nanotubes as TIM is a vital factor for the growth of this market.
Greater efficiency in green energy development is yet another factor fueling the growth of TIM.
New mild hybrid vehicles are forecasted to acquire EV modes of operation within next five years which will escalate the use of TIM.
Many driving factors such as rapid industrialization in emerging markets such as China, India, Russia, and South Korea due to increasing population, lower energy consumption, coupled with up-gradation to new technology in key sectors like electronics, energy, automotive and more has attributed to the growth in thermal interface materials market.
The increasing internet penetration rate demands a higher bandwidth for offering uninterrupted service to the users. This is driving the growth in TIM market.

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Key players of Thermal Interface Material Market:

Parker Hannifin Corporation, Henkel, Honeywell International Inc. 3M, DoW Corning, are the key players in Thermal Interface Material Market.
Henkel company have developed some unique and user- friendly products to address thermal transfer priorities of electronic products.
Henkel is the leading supplier in the Thermal Interface Materials Market contributing to nearly 28% of the overall revenue. This is followed by Parker Hannifin Corporation holding 10% share. Henkel, through its broad range of products, constant product launches and innovation have been successful in catering to a variety of customers and consequently maintaining their hold over the market.

Thermal Interface Material Market Report is segmented as indicated below
Thermal Interface Material Market By Type:
1.Thermal Greases
2.Gap Fillers
3.Adhesives & Tapes
4.Metal-Based TIM
5.Phase Change Materials
6.Others
Thermal Interface Market By Application
1.Computers (IT/Enterprise)
2.Telecommunication
3.Medical Devices
4.Automotive & Power Electronics
5.Industrial
6.Others
Thermal Interface Materials Market By Geography (Covers 15 + Countries)
Thermal Interface Materials Market By Entropy

Companies Cited/Referenced/Interviewed:
KGS Kitagawa Industries Co. Ltd
Adura LED Solutions
Shenzen Aochaun Technology Co. Ltd
Inkron Limited
European Thermodynamics Ltd
Epoxyset, Inc;
Junpus International
Wakefiled – Vette, Inc;
Stockwell Elastomers Inc;
Kenner Material & System Co; Ltd
Titan Technology Limited
I.M. Technology Co. Ltd
AOS Thermal Compounds
AI Technology
Fabri-Tech Components Inc;
Bostik
Denka Company
Semikron
Laird PLC
Dymax Corporation
Indium Corporation
Shin-ETSU Chemical Co. ltd

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What can you expect from the report?
The Thermal Interface Materials Market is Prepared with the Main Agenda to Cover the following 20 points:

1.Market Size by Product Categories
2.Market trends
3.Manufacturer Landscape
4.Distributor Landscape
5.Pricing Analysis
6.Top 10 End user Analysis
7.Product Benchmarking
8.Product Developments
9.Mergers & Acquisition Analysis
10.Patent Analysis
11.Demand Analysis (By Revenue & Volume)
12.Country level Analysis (15+)
13.Competitor Analysis
14.Market Shares Analysis
15.Value Chain Analysis
16.Supply Chain Analysis
17.Strategic Analysis
18.Current & Future Market Landscape Analysis
19.Opportunity Analysis
20.Revenue and Volume Analysis


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