Semiconductor Assembly and Testing Services 2017 Global Market Expected to Grow at CAGR 5.68 % and Forecast to 2021
The report provides in depth study of “Semiconductor Assembly and Testing Services” using SWOT analysis Weakness, Opportunities and Threat to the organization
PUNE, INDIA, November 2, 2017 /EINPresswire.com/ -- Semiconductor Assembly and Testing Services Market Analysis And Forecast
About Semiconductor Assembly and Testing Services
The number of electronic devices we use in our day-to-day life has been increasing in the past few decades. These devices range from simple media players, smartphones, laptops, and TVs to wearable smart watches and Internet of Things (IoT) devices such as connected thermostats, automated lighting, and remote health monitoring equipment. Semiconductor assembly and testing services (SATS) or outsourced semiconductor assembly and testing (OSAT) refers to the outsourcing of integrated circuit packaging and final product testing to third-party service providers.
Technavio’s analysts forecast the global semiconductor assembly and testing services market to grow at a CAGR of 5.68% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor assembly and testing services market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global Semiconductor Assembly and Testing Services Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Amkor Technology
• ASE Group
• Jiangsu Changjiang Electronics Technology (JCET)
• Powertech Technology
• Siliconware Precision Industries (SPIL)
Other prominent vendors
• Chipbond Technology
• ChipMOS TECHNOLOGIES
• FormFactor
• Formosa Advanced Technologies
• King Yuan ELECTRONICS
• Lingsen Precision Industries
• PSi Technologies
• SIGNETICS
• Tessolve Semiconductor
• Tianshui Huatian Technology
• Unisem
• UTAC
Market driver
• Growth of cloud-based servers and big data services
• For a full, detailed list, view our report
Market challenge
• Highly cyclic nature of electronics industry
• For a full, detailed list, view our report
Market trend
• Growth of advanced system in package (SiP) modules
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
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Table of Contents:
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
• Market outline
PART 05: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis
PART 06: Market segmentation by service
• Market overview
• Assembly services
• Testing services
PART 07: Geographical segmentation
• Market overview
• Semiconductor assembly and testing services market in APAC
• Semiconductor assembly and testing services market in Americas
• Semiconductor assembly and testing services market in EMEA
PART 08: Decision framework
PART 09: Drivers and challenges
• Market drivers
• Market challenges
PART 10: Market trends
• Growth of advanced system in package (SiP) modules
• Increasing focus of semiconductor suppliers on core competencies
• Growing demand for FOWLP solutions
PART 11: Vendor landscape
• Competitive scenario
• Other prominent vendors
PART 12: Key vendor analysis
• Amkor Technology
• ASE Group
• Jiangsu Changjiang Electronics Technology (JCET)
• Powertech Technology
• Siliconware Precision Industries (SPIL)
PART 13: Appendix
• List of abbreviations
List of Exhibits
Continued…….
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